AMD Ryzen 5000 Mobile Zen3 architecture detailed

AMD is lifting the embargo on details of the AMD Ryzen 5000 mobile series architecture today. AMD has confirmed a die size of 180 mm2 for Cezanne APU, a 15 percent increase over Renoir. There are 10.78 billion transistors in the APU, which is a 10% rise over its predecessor. The company lists all the major enhancements that come with the Zen3 based APU in a new slide deck. A doubled L3 cache to 16 MB, which is now shared among all CPU cores, is the most significant change alongside the upgraded new Zen3 core design. The APU also supports LPDDR4 memory, which is more common for laptop designs that are ultra-thin.

AMD claims that a ‘historic single thread performance uplift’ will be provided by their new Zen3 mobile processors. In fact, AMD claims that the unlocked 8-core high-end CPU Ryze9 5900HX will be up to 19% faster than the current Intel Core i9-10980HK flagship.

Only months after the Zen2 was introduced, AMD revealed that their Zen3 mobile CPU was taped out. The Cezanne APU has a lot in common with Renoir, with the only significant difference being the Zen3 core of upgraded computing. The APU still depends on the integrated Vega 7nm GPU, but there has also been an upgrade on this front. Up to 2.1 GHz is now clocked on the new Vega iGPU. AMD claims that there are new power control functions that enhance battery life by up to 2 hours. For example, for the memory controller, the Zen3-based APU now has a deep power state, or the APU can now regulate voltage per core, which reduces the entire processor’s power input. AMD announced at CES 2021 that Ryzen 5000H and 5000U based laptops will start shipping in February. Through various retailers, the new laptops can already be preordered.

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