AMD ‘s latest, next-gen desktop-based Zen 2 architecture performed well on the market and proved significantly superior to its predecessor. Digitimes recently published important details concerning the Zen 3 sequence. AMD will reportedly remove the 7 nm EUV process for the TSMC and replace it with a 5 nm node for its current Zen 3 architecture. The computer giant will use the Zen 3 codenamed ‘Vermeer’ in its upcoming Ryzen 4000 Desktop series.
Ryzen 4000 Set to Use 5nm+ Process Node
The study which Chia posted on Twitter indicates that AMD will be one of the TSMC 5nm+ process node ‘s leading customers. AMD was speculated to replace its current Zen 2 which features the 7 nm node of TSMC with a more advanced 7 nm EUV process for its Zen 3. It seems as if the tech giant has opted to go for the latest 5nm+ high-tech process node, if. This would offer a big performance uplift to Zen 3 processors over the current Zen 2 processors then. The study indicates that AMD is the first to use the latest 5nm+ process node in its current lineup of Zen 3.
Since TSMC announced the chip’s mass production in the fourth quarter of 2020, we can expect to see availability and launch by 2021. The CES 2021 can serve as a launch platform to unveil the next-gen Ryzen 4000 ‘Vermeer’ series. The papers, however, only mention Ryzen 4000 series for using a 5nm+ process node. Although the Milan lineup of EPYC CPU’s will also use the latest Zen 3 architecture, it is not mentioned in the article. AMD is suspected of delaying the first server shipment to 2021 to use the new 5nm+ process node in it too.
The article indicates that AMD is not only aiming for Ryzen 4000 ‘s 5 nm node method but a much-advanced version of it. Prior to this, it was announced that the latest 5nm+ node process will feature in the Zen 4 architecture. It seems, however, that AMD has gone ahead to step up the competition, using this exclusive Zen 3 architecture processor.
Zen 3 (Ryzen 4000) ‘Vermeer’ CPUs
The next new Zen 3 architecture is supposed to be the biggest CPU design ever since the original Zen. The upcoming chip has been fully re-engineered and focuses on three key features including IPC improvements, higher clock speeds and high performance. Many reports point out that the current Zen architecture along with major cache redesign brings 17 percent IPC gains along with a 50 percent improvement in floating-point operations in Zen 3. The EPYC presentation stressed that there would be a unified cache for the new upcoming architecture. This would double the access cache for each Zen 3 core, compared to the Zen 2.
The new CPU’s are also expected to get a clock boost of 200-300 MHz. This will put the Zen 3 Ryzen processors closer to the core product of Intel’s 9th Generation. Together with the substantial IPC gain and general design improvements, the massive clock boost will result in a much faster performance over Ryzen 3000 that was already a huge improvement over Ryzen 2000 and Ryzen 1000 seriesZ
A significant blow to Intel may be the latest Zen 3 processor that features a 5nm+ node process expected to be with AMD’s 2021 lineup. The explanation is that Intel will still rely on the 10 nm TSMC process for most of its 2021 line-ups. Intel’s new Comet Lake-S and Rocket Lake-S desktop processors will compete against the Ryzen ‘Vermeer’ line-up. According to numerous recent performance leaks, the Ryzen 3000 is already a rival to Intel’s Comet Lake-S. Rocket Lake-S, however, is a greater uplift to Intel. But the Intel’s Rocket Lake-S has yet to be evaluated before being called a Zen 3 competitor.
All these claims are not officially verified at this point in time and nothing is set in stone yet. However, if the new Rocket Lake-S proves to be a competitor over Zen 3 even then AMD would be at an advantage due to the availability of the new process technology for 5nm+ nodes.